| 书目名称 | Chemical-Mechanical Planarization of Semiconductor Materials |
| 编辑 | Michael R. Oliver (Rodel Fellow) |
| 视频video | http://file.papertrans.cn/225/224499/224499.mp4 |
| 概述 | Comprehensive book covering the technology of CMP for all semiconductor related materials, as well as.the science and modelling of the various mechanisms.Includes supplementary material: |
| 丛书名称 | Springer Series in Materials Science |
| 图书封面 |  |
| 描述 | Chemical Mechanical Planarization (CMP) has emerged in the last two decades and grown rapidly as a basic technology widely used in semiconduc tor device fabrication. As a semiconductor processing step, it was developed at IBM in the mid 1980s. From this beginning the technology has been widely adopted throughout the semiconductor industry. As basic CMP technology has been understood and accepted throughout the semiconductor industry, its uses in different parts of the semiconductor process have multiplied. This includes special steps for some special process ing flows, such as for DRAM technology. In addition, the availability of CMP technology has enabled the implementation of new technologies, with the best example being copper interconnect technology. Copper could not be practi cally implemented into semiconductor process flows until the advent of CMP. Unfortunately, the rapid acceptance and implementation of CMP technol ogy in wafer fabrication has occurred without a corresponding rate of advance in the underlying science. Progress is being made in understanding the un derlying CMP mechanisms, but, in general, it is slow and uneven. The most noteworthy exception to this tr |
| 出版日期 | Book 2004 |
| 关键词 | dielectrics; material; metals; reactions; semiconductor; semiconductor technology |
| 版次 | 1 |
| doi | https://doi.org/10.1007/978-3-662-06234-0 |
| isbn_softcover | 978-3-642-07738-8 |
| isbn_ebook | 978-3-662-06234-0Series ISSN 0933-033X Series E-ISSN 2196-2812 |
| issn_series | 0933-033X |
| copyright | Springer-Verlag Berlin Heidelberg 2004 |
|Archiver|手机版|小黑屋|
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