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Titlebook: Chemical Vapor Deposition; Thermal and Plasma D Srinivasan Sivaram Book 1995 Springer Science+Business Media New York 1995 chemistry.deposi

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书目名称Chemical Vapor Deposition
副标题Thermal and Plasma D
编辑Srinivasan Sivaram
视频videohttp://file.papertrans.cn/225/224462/224462.mp4
图书封面Titlebook: Chemical Vapor Deposition; Thermal and Plasma D Srinivasan Sivaram Book 1995 Springer Science+Business Media New York 1995 chemistry.deposi
描述In early 1987 I was attempting to develop a CVD-based tungsten process for Intel. At every step ofthe development, information that we were collecting had to be analyzed in light of theories and hypotheses from books and papers in many unrelated subjects. Thesesources were so widely different that I came to realize there was no unifying treatment of CVD and its subprocesses. More interestingly, my colleagues in the industry were from many disciplines (a surface chemist, a mechanical engineer, a geologist, and an electrical engineer werein my group). To help us understand the field of CVD and its players, some of us organized the CVD user‘s group of Northern California in 1988. The idea for writing a book on the subject occurred to me during that time. I had already organized my thoughts for a course I taught at San Jose State University. Later Van Nostrand agreed to publish my book as a text intended for students at the senior/first year graduate level and for process engineers in the microelectronics industry, This book is not intended to be bibliographical, and it does not cover every new material being studied for chemical vapor deposition. On the other hand, it does present the
出版日期Book 1995
关键词chemistry; deposition; design; dielectrics; engine; film; kinetics; processing; research; semiconductor; semic
版次1
doihttps://doi.org/10.1007/978-1-4757-4751-5
isbn_softcover978-1-4757-4753-9
isbn_ebook978-1-4757-4751-5
copyrightSpringer Science+Business Media New York 1995
The information of publication is updating

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Manufacturability,process. It provides a framework to increase the efficiency with which processes can be made manufacturable. I believe this framework should be a prerequisite for all process/equipment engineers who hope to work in the microelectronic industry.
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Chemical Equilibrium and Kinetics,. This reaction is usually endothermic and the energy needed for the forward progress of this reaction can come from many sources: thermal, electrical plasmas, photons, etc. The earliest and most common means of supplying energy to the CVD reaction is by heating the substrate and this technique is c
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Reactor Design for Thermal CVD,products. We will treat this subject with a narrower focus: thin films with desired properties from gaseous sources. Such a discussion may be insufficient for the design of a commercial reactor from first principles. However, for the modification of an existing reactor for the purpose of tailoring f
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CVD of Conductors,As device dimensions and film thicknesses scale down, thin film properties of conductors (see Chapter 2) begin to dominate and special processing conditions become necessary. For instance, it becomes essential to lower the processing temperature so as to minimize undesirable thermally activated proc
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CVD of Dielectrics,s are more varied when compared to the applications of conductors. Silicon-based integrated circuit technology owes its popularity in no small measure to the existence of a stable native dielectric, SiO.. SiO. is used as the gate oxide in MOS devices, where it dictates their performance. Dielectrics
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CVD of Semiconductors,n theory, the growth of single-crystal thin films to match the substrate lattice, or epitaxy, is possible through most common methods of thin film deposition, such as evaporation, PVD, and CVD. However, CVD, liquid phase epitaxy and molecular beam epitaxy are the most commonly used methods of epitax
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