| 书目名称 | Carbon Nanotubes for Interconnects | | 副标题 | Process, Design and | | 编辑 | Aida Todri-Sanial,Jean Dijon,Antonio Maffucci | | 视频video | http://file.papertrans.cn/222/221619/221619.mp4 | | 概述 | Provides a single-source reference on carbon nanotubes for interconnect applications.Includes complete coverage of current Cu-based interconnect problems for both 2D and 3D interconnects.Covers topics | | 图书封面 |  | | 描述 | This book provides a single-source reference on the use of carbon nanotubes (CNTs) as interconnect material for horizontal, on-chip and 3D interconnects. The authors demonstrate the uses of bundles of CNTs, as innovative conducting material to fabricate interconnect through-silicon vias (TSVs), in order to improve the performance, reliability and integration of 3D integrated circuits (ICs). This book will be first to provide a coherent overview of exploiting carbon nanotubes for 3D interconnects covering aspects from processing, modeling, simulation, characterization and applications. Coverage also includes a thorough presentation of the application of CNTs as horizontal on-chip interconnects which can potentially revolutionize the nanoelectronics industry. This book is a must-read for anyone interested in the state-of-the-art on exploiting carbon nanotubes for interconnects for both 2D and 3D integrated circuits. | | 出版日期 | Book 2017 | | 关键词 | 3D Integrated Circuits; Carbon Nanotubes; Carbon Nanotubes and Nanostructures; Graphene; Graphene Nanori | | 版次 | 1 | | doi | https://doi.org/10.1007/978-3-319-29746-0 | | isbn_softcover | 978-3-319-80642-6 | | isbn_ebook | 978-3-319-29746-0 | | copyright | Springer International Publishing Switzerland 2017 |
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