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Titlebook: Bits on Chips; Harry Veendrick Book 2019Latest edition Springer International Publishing AG, part of Springer Nature 2019 Introduction to

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发表于 2025-3-21 18:50:28 | 显示全部楼层 |阅读模式
期刊全称Bits on Chips
影响因子2023Harry Veendrick
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发行地址Explains integrated circuit design, implementation, fabrication and application in a well-balanced and detailed fashion.Targets any reader who is curious about chips: from individuals with only a litt
图书封面Titlebook: Bits on Chips;  Harry Veendrick Book 2019Latest edition Springer International Publishing AG, part of Springer Nature 2019 Introduction to
影响因子.This book provides readers with a broad overview of integrated circuits, also generally referred to as micro-electronics. The presentation is designed to be accessible to readers with limited, technical knowledge and coverage includes key aspects of integrated circuit design, implementation, fabrication and application. The author complements his discussion with a large number of diagrams and photographs, in order to reinforce the explanations. The book is divided into two parts, the first of which is specifically developed for people with almost no or little technical knowledge. It presents an overview of the electronic evolution and discusses the similarity between a chip floor plan and a city plan, using metaphors to help explain concepts. It includes a summary of the chip development cycle, some basic definitions and a variety of applications that use integrated circuits. The second part digs deeper into the details and is perfectly suited for professionals working in one of thesemiconductor disciplines who want to broaden their semiconductor horizon..
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发表于 2025-3-21 21:36:26 | 显示全部楼层
What Is a Chip?imply .. Generally the word chip refers to a small and very thin piece of material, sometimes broken from a larger piece of material. When a chip is not yet packaged, we call it a .. So, most integrated circuits are produced as dies on very thin (less than 1 mm thick) silicon wafers (Fig. 2.1). Usua
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发表于 2025-3-22 05:43:51 | 显示全部楼层
The Chip Development Cycle steps. Because about 90% of all ICs are made in a complementary metal oxide semiconductor (.) process, this section, but also the remaining of the book, will be focussed on this technology only. For the following discussions, the reader is advised to regularly refer to the figure below.
发表于 2025-3-22 11:31:47 | 显示全部楼层
发表于 2025-3-22 13:06:45 | 显示全部楼层
Analog IP, Interfaces and Integrationrest. On the contrary, the performance of the analog circuits and chip interfaces may be the differentiating factor to achieve the best overall system performance. A short summary on these circuits is therefore a minimum requirement to complete the picture of integrated circuits.
发表于 2025-3-22 20:31:46 | 显示全部楼层
Wafers and Transistors a very dominant role in their performance and reliability. Aware of this fact, Lilienfeld used copper sulphide as a semiconductor starting material in 1930. Germanium was used during the early 1950s. Until 1960, however, usable . could not be manufactured. During the 1960s, the move from germanium
发表于 2025-3-22 23:16:16 | 显示全部楼层
Lithographyns in all layers are represented in a layout. The generation of such a layout is usually done via an interactive graphics display for handcrafted layouts (certain analog circuits and/or some basic digital cells) or by means of synthesis, place-and-route and floor-planning tools, as discussed in Chap
发表于 2025-3-23 02:26:19 | 显示全部楼层
Fabricationhe introduction of the MOS transistor in integrated circuits during the 1970s. Often the process-related discussions are either focussed towards that part of the process in which the transistors are fabricated or towards the part in which the contacts and interconnections are fabricated. These parts
发表于 2025-3-23 06:43:11 | 显示全部楼层
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