Titlebook: Bio and Nano Packaging Techniques for Electron Devices; Advances in Electron Gerald Gerlach,Klaus-Jürgen Wolter Book 2012 Springer-Verlag B

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Platform Technologies for Pico-liter Printing and Nano-imprintingt high density on circuit boards, microtechnically manufactured optical benches, or NEMS. For such tasks, appropriate platform technologies are already available (Table 11.1). This chapter will introduce design and properties of the respective equipment.

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Nanoparticle-Based Resistors and Conductorsacy on top of components with almost any geometry. Additionally, the alignment of filler particles in an electric field by dielectrophoresis is discussed in detail. This technique enables a high conductivity of the composite at a low filling degree and in general a precise adjustment of the electric

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Bio and Nano Packaging Techniques for Electron DevicesAdvances in Electron

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Koen Lemmink,Michel Brink,Esther Nederhoft high density on circuit boards, microtechnically manufactured optical benches, or NEMS. For such tasks, appropriate platform technologies are already available (Table 11.1). This chapter will introduce design and properties of the respective equipment.

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