期刊全称 | Asymptotic Waveform Evaluation | 期刊简称 | And Moment Matching | 影响因子2023 | Eli Chiprout,Michel S. Nakhla | 视频video | | 学科分类 | The Springer International Series in Engineering and Computer Science | 图书封面 |  | 影响因子 | The intense drive for signal integrity has been at the forefront ofrapid and new developments in CAD algorithms. Thousands ofengineers, intent on achieving the best design possible, use SPICE on a daily basis for analog simulation and general circuit analysis. But the strained demand for high data speeds, coupled with miniaturizationon an unprecedented scale, has highlighted the previously negligible effects of interconnects; effects which are not always handled appro priately by the present levels of SPICE. Signals at these higher speeds may be degraded by long interconnect lengths compared to the increasingly shorter sig nal rise times. Interconnect structures can be diverse (pins, connectors, leads, microstrips, striplines, etc. ) and present at any of the hierarchical packaging levels: integrated circuits, printed circuit boards, multi-chip modules or sys tem backplanes. Analysis of these effects in any CAD package has become a necessity. Asymptotic waveform evaluation (AWE) and other moment matching tech niques have recently proven useful in the analysis of interconnect structures and various networks containing large linear structures with nonlinear termi nations. Previo | Pindex | Book 1994 |
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