Titlebook: Ambient Intelligence with Microsystems; Augmented Materials Kieran Delaney Book 2008 Springer-Verlag US 2008 CompTIA RFID+.Internet of Thi

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书目名称Ambient Intelligence with Microsystems读者反馈学科排名

puzzle

https://doi.org/10.1007/978-3-322-93447-5ed materials and smart objects. This chapter briefly presents the principles of computer networking and presents a state of the art of communication protocols for embedded wireless networks. It then presents an overview of the main wireless communication system standards and selected low power propr

Dedication

Maria Green Cowles,Thomas Rissecation by providing users, as well as computing and communication services, with relevant information. This would make it possible to create value added services for smart environments and augmented artefacts, making the system effectively context-aware. [2]. This chapter will explore both the conce

ligature

https://doi.org/10.1007/978-3-86226-351-6iate abstractions and a new affordance (composeability) that objects acquire. Specifically our contribution is firstly to discuss the conceptual abstractions and formal definitions used to model such artifact collections, which are inherent to ubiquitous computing, and secondly to discuss engineerin

FOIL

Oscar W. Gabriel,Frank Brettschneidered significant attention. This concept envisages the “harvesting” of energy from sources available in the environment to either directly power, or to augment the battery powering of, the wireless sensor node. Although many different sources of energy have been discussed, the sources for which practi

芳香一点

https://doi.org/10.1007/978-3-322-92488-9ch programmes. In this chapter, the issue of NES reliability is examined primarily in the context of the systems hardware, principally the node, and the associated reliability research challenges are discussed. While there is much to be learnt from past research on reliability research in distribute

Amenable

1389-2134 ls and Smart Objects describes and discusses a number of vision statements strongly relevant to the future development of distributed embedded sensor and actuator platforms for smart objects, and ultimately Amb978-1-4419-4277-7978-0-387-46264-6Series ISSN 1389-2134

MAG

Augmenting Materials to Build Cooperating Objectsy embedded distributed information systems, designed to measure all relevant properties, and provide a full knowledge representation of the material; in effect, the material would “know” itself, and its current status. The basic premise is not new; many systems techniques have proposed and implement

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