Titlebook: Agent-Based Manufacturing; Advances in the Holo S. M. Deen Book 2003 Springer-Verlag Berlin Heidelberg 2003 Agent-Based Technologies.Distri

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书目名称Agent-Based Manufacturing影响因子(影响力)




书目名称Agent-Based Manufacturing影响因子(影响力)学科排名




书目名称Agent-Based Manufacturing网络公开度




书目名称Agent-Based Manufacturing网络公开度学科排名




书目名称Agent-Based Manufacturing被引频次




书目名称Agent-Based Manufacturing被引频次学科排名




书目名称Agent-Based Manufacturing年度引用




书目名称Agent-Based Manufacturing年度引用学科排名




书目名称Agent-Based Manufacturing读者反馈




书目名称Agent-Based Manufacturing读者反馈学科排名

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Andrea Caforio,Fatih Balli,Subhadeep Banikrganising abilities is undertaken. This comparison reveals a rich insight into the similarities and differences among them that can be fruitfully exploited to fill any shortcomings in one or another concept.

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Cryptology and Network Securityne assembly testbed and Rockwell Automation’s proposed simulation testbed for elaborating the fault-tolerant operational model. Although the manufacturing requirements used for this study are necessarily abstract, the ideas discussed in this chapter can provide a useful abstract foundation for many

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An HMS Operational Modelne assembly testbed and Rockwell Automation’s proposed simulation testbed for elaborating the fault-tolerant operational model. Although the manufacturing requirements used for this study are necessarily abstract, the ideas discussed in this chapter can provide a useful abstract foundation for many

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y driven research project assures practical relevance of resLow-volume high-variety products like personalized cars or customized engines will be the key issues for manufacturing in the 21st century. The necessary control technology is based on the concept of holons, which are the units of productio

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Jun Xu,Lei Hu,Siwei Sun,Ping Wangffective system integration and coordination are also necessary. The second part of this chapter looks at recent efforts to achieve system integration and coordination through emerging technologies such as multi-agent systems and holonic manufacturing systems.

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Conduit

Omer Berkman,Benny Pinkas,Moti Yungefined in the International Electrotechnical Commission (IEC) 61499 series of standards, can be used for encapsulation, reuse, distribution and integration of both LLC and HLC functions, while HLC functionality can be standardized as defined by the Foundation for Intelligent Physical Agents (FIPA).