Titlebook: Advances in RAMS Engineering; In Honor of Professo Durga Rao Karanki,Gopika Vinod,Srividya Ajit Book 2020 Springer Nature Switzerland AG 20

INFER

书目名称Advances in RAMS Engineering影响因子(影响力)




书目名称Advances in RAMS Engineering影响因子(影响力)学科排名




书目名称Advances in RAMS Engineering网络公开度




书目名称Advances in RAMS Engineering网络公开度学科排名




书目名称Advances in RAMS Engineering被引频次




书目名称Advances in RAMS Engineering被引频次学科排名




书目名称Advances in RAMS Engineering年度引用




书目名称Advances in RAMS Engineering年度引用学科排名




书目名称Advances in RAMS Engineering读者反馈




书目名称Advances in RAMS Engineering读者反馈学科排名

stress-test

DevOps for IT Service Reliability and Availabilityelligence (AI) are redefining the business and the services that these businesses provide. Their widespread usage is changing the business landscape, increasing reliability and availability to levels that were unimaginable even a few years ago.

唤起

Ergots

Charlatan

Sanfeng Chen,Xin Han,Fei Tang,Guangming Lin (BDD) to evaluate the performance of the microgrid system in terms of reliability. Moreover, a comparative study is also executed in order to inspect the effectiveness of the proposed hybrid approaches.

杂色

认识

Reliability Analysis of Microgrid Systems Using Hybrid Approaches (BDD) to evaluate the performance of the microgrid system in terms of reliability. Moreover, a comparative study is also executed in order to inspect the effectiveness of the proposed hybrid approaches.

Servile

The Unpopularity of the Software Tester Role Among Software Practitioners: A Case Studyividuals were asked the PROs (advantages or motivators) and CONs (disadvantages or de-motivators) of taking up a career in software testing and their chances of doing so. The results of this investigation identified 9 main PROs and 8 main CONs for taking up a testing career showing that the role of tester is perceived as a social role.

Supplement

Book 2020ghts the multidisciplinary nature of complex engineering systems. The book provides a quick reference to the latest advances and terminology in various engineering fields, assisting students and researchers in the areas of reliability, availability, maintainability, and safety engineering..

打包

Fatigue Life Model for PLCC Solder Joints Under Thermal Cycling Stressof solder joints. Thermal cycling is reported to be the major cause of failures. Life estimation of solder joints is important to predict the time to failure and take counter measures. The chapter addresses this issue by specializing an established empirical model for fatigue failure, Coffin-Manson, for a PLCC solder joint using experimental data.