Titlebook: Advances in Electronic Circuit Packaging; Volume 5 Proceedings Lawrence L. Rosine (Editor, EDN) Conference proceedings 1965 Springer Scienc

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书目名称Advances in Electronic Circuit Packaging影响因子(影响力)学科排名




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书目名称Advances in Electronic Circuit Packaging网络公开度学科排名




书目名称Advances in Electronic Circuit Packaging被引频次




书目名称Advances in Electronic Circuit Packaging被引频次学科排名




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书目名称Advances in Electronic Circuit Packaging年度引用学科排名




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书目名称Advances in Electronic Circuit Packaging读者反馈学科排名

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https://doi.org/10.1007/978-3-030-49900-6 product of this combined effort has been a reliable command unit with the impressive circuit density of approximately 1100 transistors, 5000 diodes, 2500 resistors, and 200 capacitors, packaged in 32 separate modules in a total volume of 155 in..

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Position sensitive X-ray detectors,wed are interconnection and packaging of thin films and integrated circuits, new motherboarding techniques which minimize back wiring problems yet retain flexibility, and a new concept of simplified prepositioned weldable circuitry for microminiature interconnection applications.

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https://doi.org/10.1007/978-1-0716-3786-9ge capacity. (2) 100-kilocycle serial-bit information rate. (3) Nondestructive readout. (4) 0.3 W maximum power consumption. (5) Approximate volume of 145 in.. (6) Approximate weight of 3.5–4 lb. (7) Operating temperature range of −20°C− +100°C.

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