Titlebook: Advances in Electronic Circuit Packaging; Volume 3 Lawrence L. Rosine (Editor, EDN (Electrical Design Book 1963 Springer Science+Business M

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A Unique Approach to Welded Packaging, per cent in the previous decade. As a result, per capita GDP fell by more than 10 per cent in the 1980s. There were few exceptions — Chile and Colombia among them — to this declining trend in real income. The recession of 1981–2 in the industrial countries and the debt crisis that erupted in the su

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How Altitude Affects Forced Air Cooling Requirements of Electronic Equipment,l disciplines. As the title of this book indicates, my own interest in religious conversion is not sociological, historical, nor anthropolog­ ical. My primary interest is not even in the domain of the psychology of religion. That is, this book is not a comprehensive review of the social psychologica

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Space Seal Study,eat importance, especially at a time when humanity is more divided than ever. Machine Learning has endless possibilities, but if used improperly, it could have far-reaching and lasting negative effects. Many of the ethical problems regarding Machine Learning have already arisen in analogous forms th

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A Packaging Method for Thin-Film Microelectronic Systems,estern European society. In company with such concepts as ‘industrial society’ as used by Saint Simon and Spencer, ‘contract’ as deployed by Maine, and ‘gesellschaft’ as elaborated by Tönnies, the term ‘capitalism’ possessed two important features. First, all such notions entailed a sense of qualita

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