| 期刊全称 | Advanced Packaging and Manufacturing Technology Based on Adhesion Engineering | | 期刊简称 | Wafer-Level Transfer | | 影响因子2023 | Seonho Seok | | 视频video | | | 发行地址 | Introduces a new and unique packaging technology.Explains microelectromechanical systems (MEMS) packaging utilizing polymers or thin films.Discusses finite element method (FEM) modeling to explain the | | 学科分类 | Springer Series in Advanced Manufacturing | | 图书封面 |  | | 影响因子 | .This book introduces microelectromechanical systems (MEMS) packaging utilizing polymers or thin films – a new and unique packaging technology. It first investigates the relationship between applied load and opening displacement as a function of benzocyclobutene (BCB) cap size to find the debonding behavior, and then presents BCB cap deformation and stress development at different opening displacements as a function of BCB thickness, which is a criterion for BCB cap transfer failure..Transfer packaging techniques are attracting increasing interest because they deliver packaging caps, from carrier wafers to device wafers, and minimize the fabrication issues frequently encountered in thin-film or polymer cap encapsulation. The book describes very-low-loss polymer cap or thin-film-transfer techniques based on anti-adhesion coating methods for radio frequency (RF) (-MEMS) device packaging. Since the polymer caps are susceptible to deformation due to their relatively low mechanical stiffness during debonding of the carrier wafer, the book develops an appropriate finite element model (FEM) to simulate the debonding process occurring in the interface between Si carrier wafer and BCB cap. | | Pindex | Book 2018 |
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发表于 2025-3-21 20:07:48
