| 期刊全称 | Advanced Materials and Components for 5G and Beyond | | 影响因子2023 | Colin Tong | | 视频video | | | 发行地址 | Provides comprehensive coverage of materials and component design for 5G with engaging insights.Explains the complex relationships between materials selection and device design and operating condition | | 学科分类 | Springer Series in Materials Science | | 图书封面 |  | | 影响因子 | .This book provides a comprehensive introduction to the current status and future trends of materials and component design for fifth-generation (5G) wireless communications and beyond. Necessitated by rapidly increasing numbers of mobile devices and data volumes, and acting as a driving force for innovation in information technology, 5G networks are broadly characterized by ubiquitous connectivity, extremely low latency, and very high-speed data transfer. Such capabilities are facilitated by nanoscale and massive multi-input multi-output (MIMO) with extreme base station and device densities, as well as unprecedented numbers of antennas. This book covers semiconductor solutions for 5G electronics, design and performance enhancement for 5G antennas, high frequency PCB materials and design requirements, materials for high frequency filters, EMI shielding materials and absorbers for 5G systems, thermal management materials and components, and protective packaging and sealing materials for 5G devices. It explores fundamental physics, design, and engineering aspects, as well as the full array of state-of-the-art applications of 5G-and-beyond wireless communications. Future challenges and | | Pindex | Book 2022 |
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发表于 2025-3-21 16:05:48
