Titlebook: Additive Manufacturing of Mechatronic Integrated Devices; Friedrich Wilhelm Proes Book 2022 The Editor(s) (if applicable) and The Author(s

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2522-8447 elting behavior of the polymer by reducing the sintering window. A fine metal powder as an alternative additive affects the sintering window less and enables a stable process. To choose a suitable particle size978-3-031-16220-6978-3-031-16221-3Series ISSN 2522-8447 Series E-ISSN 2522-8455

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Amit Satapathy MD,Vandana Jain MD Starlink, a network of 653 satellites orbiting the earth [1]. SpaceEx has received approval to launch about 11,900 more satellites by November 2027 [2], the company has requests pending for another 30,000 satellites [3]. The fast-moving lights are the result of current technological developments co

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Bodhana Dhole PhD,Anand Kumar MD, FAMSology selective laser sintering (SLS) with conventional laser direct structuring (LDS). LDS is already established in the electronics industry to create molded interconnect devices (MID), and is based on injection molding. The fields of additive manufacturing (AM) and conventional MID production are

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Amit Satapathy MD,Vandana Jain MDnufacturing of mechatronic integrated devices (AMMID) process. In this development process, all process steps that are essential for the operation of the entire process chain were tested in experiments. In order to ensure that all relevant questions would be addressed, a systematic experimental stra

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https://doi.org/10.1007/978-981-10-3695-8technologies. The aim is to confirm the versatility of the process, which is of great importance in order to enter a broad market. Substrate materials must meet the requirements posed by specific applications. High activation rates are necessary to ensure an efficient production process, with high p

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Sohan Singh Walia,Tamanpreet Kaurhe search must focus on parts that ideally include functionalities such as sensors, heaters, antennae or electromagnetic shielding. The technical feasibility of these functionalities with the AMMID process chain still needs to be investigated with regard to the respective application.