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Titlebook: A Guide to Lead-free Solders; Physical Metallurgy John W. Evans,Werner Engelmaier (Engelmaier Associ Book 2007 Springer-Verlag London 2007

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期刊全称A Guide to Lead-free Solders
期刊简称Physical Metallurgy
影响因子2023John W. Evans,Werner Engelmaier (Engelmaier Associ
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发行地址Covers all aspects of lead-free solders from physical properties to product assurance.The reader will be able to choose new solders more suitable to the climate of legislation and public opinion based
图书封面Titlebook: A Guide to Lead-free Solders; Physical Metallurgy  John W. Evans,Werner Engelmaier (Engelmaier Associ Book 2007 Springer-Verlag London 2007
影响因子The transition to lead-free solders seems to be a foregone conclusion with Japan and Europe leading the way. Indeed some key companies will move to lead free soon and the WEEE Directive 2002/96/EC on Waste Electrical and Electronic Equipment will require all companies doing business in the EU to transition to lead-free. Compliance with forthcoming lead-free regulations will ultimately fall to individual companies and the engineers responsible for design and prod- tion of electronic products and they must be prepared with adequate knowledge of the materials that are leading candidates and they must be prepared to fill the gaps in the data base for their own products. Research worldwide over the past 10 years has produced data and direction for choosing an alloy to substitute for near-eutectic SnPb alloys. This book will provide a valuable resource for engineers involved in the transition to products. Basic theory is presented on the physical metallurgy of soldering technology including elements of assembly, surface finishes and solder-paste technology, wetting and solidification, microstructural instability and intermetallic c- pounds and mechanical, creep and fatigue behavior. Tech
Pindex Book 2007
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Mechanical Properties and Creep Behavior,ugleich: Sich Klarheit darüber zu verschaffen, wo man eigentlich steht, woher man kommt, wohin man überhaupt will. Wozu man sich denn anstrengt, was man sich davon tatsächlich erhofft und ob das Erhoffte denn erreichbar ist — im wissenschaftlichen Arb- ten ebenso wie natürlich im Leben überhaupt. Da
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978-1-84996-577-4Springer-Verlag London 2007
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Book 2007to products. Basic theory is presented on the physical metallurgy of soldering technology including elements of assembly, surface finishes and solder-paste technology, wetting and solidification, microstructural instability and intermetallic c- pounds and mechanical, creep and fatigue behavior. Tech
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