SCIE期刊IEEE Transactions on Components Packaging and Manufacturing Technology 2024/2025影响因子:2.373 (IEEE T COMP PACK MAN)

不透气

Submitted on: 06 August 2004. Revised on: 11 November 2004. Accepted on: 03 December 2004. ___________________IEEE Transactions on Components Packaging and Manufacturing Technology

HAVOC

Submitted on: 08 March 2000. Revised on: 21 May 2000. Accepted on: 31 May 2000. ___________________IEEE Transactions on Components Packaging and Manufacturing Technology

HALL

engrossed

返老还童

Submitted on: 04 December 2009. Revised on: 08 January 2010. Accepted on: 03 March 2010. ___________________IEEE Transactions on Components Packaging and Manufacturing Technology

一再困扰

Submitted on: 08 April 2013. Revised on: 02 May 2013. Accepted on: 17 May 2013. ___________________IEEE Transactions on Components Packaging and Manufacturing Technology

贪心

Submitted on: 27 July 2021. Revised on: 15 October 2021. Accepted on: 18 November 2021. ___________________IEEE Transactions on Components Packaging and Manufacturing Technology

Onerous

Submitted on: 27 December 2021. Revised on: 06 February 2022. Accepted on: 04 April 2022. ___________________IEEE Transactions on Components Packaging and Manufacturing Technology

得罪

Submitted on: 14 February 2025. Revised on: 19 April 2025. Accepted on: 25 May 2025. ___________________IEEE Transactions on Components Packaging and Manufacturing Technology

有毛就脱毛