力学
发表于 2025-3-21 16:23:54
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CHARM
发表于 2025-3-21 22:23:32
Daniel Lu,C.P. WongProvides a comprehensive summary of the most recent advances in materials development for advanced packaging.Covers emerging technologies such as digital health, bio-medical, and nano-materials / proc
跑过
发表于 2025-3-22 00:34:51
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BILIO
发表于 2025-3-22 05:39:54
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CHART
发表于 2025-3-22 12:06:38
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Negotiate
发表于 2025-3-22 13:31:23
Springer-Verlag US 2009
不遵守
发表于 2025-3-22 17:40:39
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construct
发表于 2025-3-22 23:34:08
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权宜之计
发表于 2025-3-23 05:06:42
Advanced Chip-to-Substrate Connections,sity of the transistors and larger chip size has also led to new challenges for chip-to-substrate connections. The pace of change in packaging and chip-to-substrate connections has accelerated because off-chip issues are increasingly a limiting factor in product cost and performance. Chip-to-substra
Dna262
发表于 2025-3-23 09:31:58
Advanced Wire Bonding Technology: Materials, Methods, and Testing,ry today. Many trillion of wirebonds are made annually using automated machines. Wirebonding is reliable, flexible, and low cost when compared to other forms of first-level microelectronic interconnection. Failures are typically at the single digit parts per million level or below. As the number of