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发表于 2025-3-25 07:25:02
Nanomaterials and Nanopackaging,s, lead-free nanosolder, carbon nanotubes (CNT) and their applications for interconnect, thermal management, and integration into microsystems. Also, operation principle, fabrication techniques, and packaging of piezoelectric nanogenerators based on vertically aligned Zinc oxide (ZnO) nanowires (NWs
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发表于 2025-3-25 10:52:04
Wafer Level Chip Scale Packaging,HI) by 3-D packaging using Through Silicon Vias (TSV). Materials and process technologies are key for a reliable WLP. It is not only the choice for the right polymer or metal but the interfaces could be even more critical like under bump metallurgy or the adhesion of polymers. This chapter focuses o
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发表于 2025-3-25 12:48:40
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flaggy
发表于 2025-3-25 17:02:05
LED and Optical Device Packaging and Materials,ield, and the device reliability and lifetime are determined by the quality of packaging and assembly materials as well as their processing. This presents serious challenges to the development of LED packaging materials, which is exactly the objective of this chapter to review those challenges and t
MAUVE
发表于 2025-3-25 21:37:10
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Desert
发表于 2025-3-26 00:11:06
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isotope
发表于 2025-3-26 05:58:03
Chin C. Lee,Pin J. Wang,Jong S. Kimtrol is a vital component for improving the performance (e.g., latency) of these services. Considering complex networking environment, the default congestion control algorithms on servers may not always be the most efficient, and new advanced algorithms will be proposed. However, adjusting congestio
Urea508
发表于 2025-3-26 09:14:04
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Cursory
发表于 2025-3-26 15:11:26
Harry K. Charles Ph.Digning efficient GPGPU chips poses many challenges. One major hurdle is the interface to the external DRAM, particularly the buffers in the memory controllers (MCs), which is stressed heavily by the many concurrent memory accesses from the GPGPU. Previous approaches considered scheduling the memory
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发表于 2025-3-26 18:04:28
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