Infirm 发表于 2025-4-1 03:09:59

http://reply.papertrans.cn/63/6259/625833/625833_61.png

GLADE 发表于 2025-4-1 06:53:23

http://reply.papertrans.cn/63/6259/625833/625833_62.png

碎石头 发表于 2025-4-1 11:22:42

http://reply.papertrans.cn/63/6259/625833/625833_63.png

即席演说 发表于 2025-4-1 15:58:07

Advanced Bonding/Joining Techniques,onding process has extensive applications in silicon-glass bonding and glass-glass bonding. Diffusion bonding process forms chemical bonds by inter-diffusion of two different atoms over the bond line. Surface-activated bonding is valuable in bonding objects with large difference in coefficients of t
页: 1 2 3 4 5 6 [7]
查看完整版本: Titlebook: Materials for Advanced Packaging; Daniel Lu,C.P. Wong Book 20091st edition Springer-Verlag US 2009 Compound.LED.Nanomaterial.development.e