Magnanimous
发表于 2025-3-21 19:39:58
书目名称Design-for-Test and Test Optimization Techniques for TSV-based 3D Stacked ICs影响因子(影响力)<br> http://impactfactor.cn/if/?ISSN=BK0268878<br><br> <br><br>书目名称Design-for-Test and Test Optimization Techniques for TSV-based 3D Stacked ICs影响因子(影响力)学科排名<br> http://impactfactor.cn/ifr/?ISSN=BK0268878<br><br> <br><br>书目名称Design-for-Test and Test Optimization Techniques for TSV-based 3D Stacked ICs网络公开度<br> http://impactfactor.cn/at/?ISSN=BK0268878<br><br> <br><br>书目名称Design-for-Test and Test Optimization Techniques for TSV-based 3D Stacked ICs网络公开度学科排名<br> http://impactfactor.cn/atr/?ISSN=BK0268878<br><br> <br><br>书目名称Design-for-Test and Test Optimization Techniques for TSV-based 3D Stacked ICs被引频次<br> http://impactfactor.cn/tc/?ISSN=BK0268878<br><br> <br><br>书目名称Design-for-Test and Test Optimization Techniques for TSV-based 3D Stacked ICs被引频次学科排名<br> http://impactfactor.cn/tcr/?ISSN=BK0268878<br><br> <br><br>书目名称Design-for-Test and Test Optimization Techniques for TSV-based 3D Stacked ICs年度引用<br> http://impactfactor.cn/ii/?ISSN=BK0268878<br><br> <br><br>书目名称Design-for-Test and Test Optimization Techniques for TSV-based 3D Stacked ICs年度引用学科排名<br> http://impactfactor.cn/iir/?ISSN=BK0268878<br><br> <br><br>书目名称Design-for-Test and Test Optimization Techniques for TSV-based 3D Stacked ICs读者反馈<br> http://impactfactor.cn/5y/?ISSN=BK0268878<br><br> <br><br>书目名称Design-for-Test and Test Optimization Techniques for TSV-based 3D Stacked ICs读者反馈学科排名<br> http://impactfactor.cn/5yr/?ISSN=BK0268878<br><br> <br><br>
情感脆弱
发表于 2025-3-21 22:07:54
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吝啬性
发表于 2025-3-22 01:11:23
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影响带来
发表于 2025-3-22 08:03:34
978-3-319-34534-5Springer International Publishing Switzerland 2014
托人看管
发表于 2025-3-22 12:02:32
Infiltration in Unsaturated Soils to mobile devices. As transistors continue their miniaturization march through smaller technology nodes, the limits of device scaling tend to be reached. Interconnects, particularly global interconnects, are becoming a bottleneck in integrated circuit (IC) design. Since interconnects do not scale a
弯弯曲曲
发表于 2025-3-22 12:57:34
https://doi.org/10.1007/978-94-009-6175-3in order to minimize cost. This determination is necessary to ensure suitably high compound stack yields, or the yield for stacking subsequent tiers on a stack. This chapter will examine two related issues—the stacking process, in particular the benefits and cost of wafer sorting, and architectures
弯弯曲曲
发表于 2025-3-22 20:42:11
https://doi.org/10.1007/978-3-030-93578-8ters 3 and 4 presented methods through BIST and probing to enable pre-bond TSV test. While TSV test is important for KGD test, it covers only a small fraction of the tests that must be performed to achieve complete KGD test. In particular, the majority of die area is dedicated to logic and associate
encomiast
发表于 2025-3-22 21:13:58
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武器
发表于 2025-3-23 03:14:10
Detection of indoor fungi bioaerosolsst in many scenarios, including memory-on-memory, memory-on-logic, and logic-on-logic stacks. BIST and probing techniques were explored for pre-bond TSV and scan test. Methods for yield assurance, including BISR architectures and wafer matching, were explained in detail. Optimizations for reducing t
配置
发表于 2025-3-23 06:56:38
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