付出 发表于 2025-3-28 15:27:01

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教唆 发表于 2025-3-28 20:52:46

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查看完整版本: Titlebook: Design-for-Test and Test Optimization Techniques for TSV-based 3D Stacked ICs; Brandon Noia,Krishnendu Chakrabarty Book 2014 Springer Inte