欢呼
发表于 2025-3-23 12:41:52
Fluid Mechanics and Its ApplicationsAs discussed in previous chapters, 3D ICs require both pre-bond and post-bond testing to ensure stack yield. The goal of pre-bond testing is to ensure that only known good die (KGD) are bonded together to form a stack. Post-bond test ensures the functionality of the complete stack and screens for defects introduced in alignment and bonding.
追踪
发表于 2025-3-23 14:47:17
Built-In Self-Test for TSVs,Pre-bond testing of individual dies prior to stacking is crucial for yield assurance in 3D-SICs . A complete known-good-die (KGD) test requires testing of die logic, power and clock networks, and the TSVs that will interconnect dies after bonding in the stack.
bizarre
发表于 2025-3-23 18:50:44
Overcoming the Timing Overhead of Test Architectures on Inter-Die Critical Paths,As discussed in previous chapters, 3D ICs require both pre-bond and post-bond testing to ensure stack yield. The goal of pre-bond testing is to ensure that only known good die (KGD) are bonded together to form a stack. Post-bond test ensures the functionality of the complete stack and screens for defects introduced in alignment and bonding.
oxidant
发表于 2025-3-23 22:31:32
https://doi.org/10.1007/978-3-030-93578-8ters 3 and 4 presented methods through BIST and probing to enable pre-bond TSV test. While TSV test is important for KGD test, it covers only a small fraction of the tests that must be performed to achieve complete KGD test. In particular, the majority of die area is dedicated to logic and associated memory.
音乐戏剧
发表于 2025-3-24 03:24:30
Pre-bond Scan Test Through TSV Probing,ters 3 and 4 presented methods through BIST and probing to enable pre-bond TSV test. While TSV test is important for KGD test, it covers only a small fraction of the tests that must be performed to achieve complete KGD test. In particular, the majority of die area is dedicated to logic and associated memory.
确定无疑
发表于 2025-3-24 07:00:56
key test and design-for-test technologies, emerging standardThis book describes innovative techniques to address the testing needs of 3D stacked integrated circuits (ICs) that utilize through-silicon-vias (TSVs) as vertical interconnects. The authors identify the key challenges facing 3D IC testing
Mosaic
发表于 2025-3-24 11:25:58
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极大痛苦
发表于 2025-3-24 15:35:59
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Essential
发表于 2025-3-24 21:38:25
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火花
发表于 2025-3-25 01:59:05
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