引起极大兴趣 发表于 2025-3-21 19:55:39

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IOTA 发表于 2025-3-21 23:25:30

Expanding the Economic Concept of Exchangemeters. Module frequencies of operation range from typical values of approximately 60 MHz for low-end digital applications to multi-gigahertz rf applications. Operating frequency is a primary socket design factor since it has a significant influence on the module contacting method.

Cleave 发表于 2025-3-22 04:02:39

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indoctrinate 发表于 2025-3-22 04:37:10

Schriften zur Unternehmensentwicklungout advanced thin-film wiring. Thin-film wiring provides the highest level of wiring for both Single Chip Modules (SCM) and Multi-chip Modules (MCM). Relative comparisons are also made for availability, cost, characteristics and various application form factors.

相容 发表于 2025-3-22 11:05:37

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AWE 发表于 2025-3-22 15:52:10

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泥沼 发表于 2025-3-22 18:02:28

Ceramic Chip Carriersout advanced thin-film wiring. Thin-film wiring provides the highest level of wiring for both Single Chip Modules (SCM) and Multi-chip Modules (MCM). Relative comparisons are also made for availability, cost, characteristics and various application form factors.

Terminal 发表于 2025-3-22 23:02:35

Laminate/HDI Die Carriersey all allow the designer to significantly increase routing density through the use of vias in SMT pads, to reduce size and weight of product, and to improve the electrical performance of the system. These types of boards are generically called, . or ..

压倒性胜利 发表于 2025-3-23 04:13:50

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mitten 发表于 2025-3-23 08:19:51

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查看完整版本: Titlebook: Area Array Interconnection Handbook; Karl J. Puttlitz,Paul A. Totta Book 2001 Kluwer Academic Publishers 2001 Potential.Scale.Wafer.develo