Excise
发表于 2025-3-28 17:08:50
Pak Chung Wong,Han-Wei Shen,Chaomei Chennted circuit card or board. Previously this family of packages has been referred to by several designations, among them: Area Array Tape Automated Bonding (ATAB) , Tape Ball Grid Array (TBGA) , fleXBGA. , Wire Bond TBGA (WB TBGA) , Signetics TBGA (S-TBGA) , Flex TBGA (FTBGA) , Star
高度
发表于 2025-3-28 20:58:40
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NAIVE
发表于 2025-3-29 00:10:09
https://doi.org/10.1057/9781137006004 input-output connections all over the face of a flip chip is also a simple idea, and twenty-five years old. Then, how is it, in the last days of the twentieth century, that the electronics industry finds itself in the midst of a revolution in electronic assembly referred to as flip-chip area-array packaging?
主动
发表于 2025-3-29 03:21:01
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丰富
发表于 2025-3-29 07:23:17
Expanding the Economic Concept of Exchanget the productivity of a manufacturing plant span from initial package design to finished product inspection. As with any manufacturing operation, tradeoffs must be constantly evaluated to achieve an acceptable balance between quality, production, cost and reliability objectives.
obsolete
发表于 2025-3-29 13:21:03
Stuart Cunningham,Peter S. Excellth increased speed and decreased energy consumption requirements has led to present day highly integrated circuits. To take advantage of the integration enhancements at the die level, much attention is focused on the supporting package performance.
hankering
发表于 2025-3-29 16:21:55
https://doi.org/10.1007/978-1-4471-2804-5rate is a thin (less than 0.035 inches) laminate similar to card technologies used for personal computers. Although the interconnections between a chip and substrate are typically wire bonds, flip-chip dice can be attached to PBGA packages as well. PBGA technologies also support chip scale packaging (CSP) discussed in Chapters 18 and 23.
assent
发表于 2025-3-29 21:24:17
History of Flip Chip and Area Array Technology input-output connections all over the face of a flip chip is also a simple idea, and twenty-five years old. Then, how is it, in the last days of the twentieth century, that the electronics industry finds itself in the midst of a revolution in electronic assembly referred to as flip-chip area-array packaging?
exorbitant
发表于 2025-3-30 02:35:10
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我悲伤
发表于 2025-3-30 07:56:30
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