Ergots
发表于 2025-3-30 09:51:31
Ceramic and Plastic Pin Grid Array Technologyth increased speed and decreased energy consumption requirements has led to present day highly integrated circuits. To take advantage of the integration enhancements at the die level, much attention is focused on the supporting package performance.
头盔
发表于 2025-3-30 13:32:32
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ANIM
发表于 2025-3-30 16:55:53
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诱惑
发表于 2025-3-30 21:16:48
Wafer Bumpinge are immediate questions which emerge: Who will put bumps on chips and how? Will the same bumped chips be joined to both ceramic and organic packages? Must all chips be joined with high-melting or low-melting solders, or not with solder at all, but with conductive adhesives? This chapter will illus
合唱队
发表于 2025-3-31 01:11:23
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neutrophils
发表于 2025-3-31 08:23:58
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packet
发表于 2025-3-31 10:15:02
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Tortuous
发表于 2025-3-31 15:48:47
Ceramic Chip Carriersic chip carrier examples for each of the six market applications which include High Performance, Cost Performance, Commodity, Hand Held and Communication, Automotive and Memory. Materials and properties are summarized for standard alumina chip carriers, high-performance materials, thin-film material
戏法
发表于 2025-3-31 19:08:31
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