milligram
发表于 2025-3-25 03:22:29
https://doi.org/10.1007/978-3-658-23316-7Wire bonds, tape automated bonding (TAB), and solder-bump, flip-chip connections more popularly referred to as controlled collapsed chip connections or C4 are the three primary chip-to-carrier interconnection technologies currently practiced.
重叠
发表于 2025-3-25 07:55:05
Expanding the Economic Concept of ExchangeThe industry has focused on replacing packaged chips such as pin-in-hole (PIH) and surface-mount components (SMT) on cards or boards. Components which do not pass electrical test or inspection are removed from cards but not chips from single chip packages. In some instances, such as plastic molded packages, removal is not a viable option.
FLAIL
发表于 2025-3-25 12:00:52
Flip-Chip Die Attach TechnologyWire bonds, tape automated bonding (TAB), and solder-bump, flip-chip connections more popularly referred to as controlled collapsed chip connections or C4 are the three primary chip-to-carrier interconnection technologies currently practiced.
Mortal
发表于 2025-3-25 17:39:47
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晚间
发表于 2025-3-25 21:42:16
https://doi.org/10.1007/978-1-4615-1389-6Potential; Scale; Wafer; development; interconnect; manufacturing; material; metal; climate change
确定无疑
发表于 2025-3-26 04:01:30
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过分
发表于 2025-3-26 06:25:21
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CANON
发表于 2025-3-26 10:02:01
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myriad
发表于 2025-3-26 12:47:20
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严厉批评
发表于 2025-3-26 20:47:26
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