Titlebook: Surface Mount Technology; Principles and Pract Ray P. Prasad Book 1989 Van Nostrand Reinhold 1989 assembly.ceramics.electronics.laser.manuf

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Adhesive and Its ApplicationAn adhesive in surface mounting is used to hold passive components on the bottom side of the board during wave soldering. This is necessary to avoid the displacement of these components under the action of the wave. When soldering is complete, the adhesive no longer has a useful function.

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Solder Paste and Its ApplicationIn the reflow soldering of surface mount assemblies, solder paste is used for the connection between the leads or terminations of surface mount components and the lands. Solder paste is applied to the surface mount lands by screening, stenciling, or dispensing. Each process has its pros and cons.

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Substrates for Surface Mountingal reliability of electronic assemblies. Before choosing from among the many types of substrate that are available for military and commercial applications, however, it is necessary to determine the properties that will be required. Then a substrate material that meets all the requirements in a cost-effective manner can be selected.

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