找回密码
 To register

QQ登录

只需一步,快速开始

扫一扫,访问微社区

Titlebook: Structural Analysis of Printed Circuit Board Systems; Peter A. Engel Book 1993 Springer Science+Business Media New York 1993 Sensor.deform

[复制链接]
楼主: 专家
发表于 2025-3-26 22:22:41 | 显示全部楼层
发表于 2025-3-27 03:16:45 | 显示全部楼层
发表于 2025-3-27 05:40:48 | 显示全部楼层
Approximate Engineering Theory for the Twisting of Compliant Leaded Circuit Card/Module Systems, analysis benefits from the symmetries. This chapter will introduce the basic problems involved in the twisting of circuit cards, and an approximate solution will be shown for a single module attached to a card. This approximate treatment, while useful in defining some concepts, also produces accept
发表于 2025-3-27 09:31:19 | 显示全部楼层
Thermal Stresses in Compliant Leaded Systems,s, however, is induced in the operational mode, owing to the differential expansion of interconnected components. Even before functional stress cycles can test the fatigue strength of the leads, severe thermal loads may arise during the cooling accompanying manufacturing, i.e., the soldering (reflow
发表于 2025-3-27 15:13:04 | 显示全部楼层
Dynamic Response of Circuit Card Systems,ead/card system, the card is the most flexible element; the fundamental natural frequency .. for circuit cards is generally between 20 and 50 Hz, and even for multimodule stiff cards or stiffened boards, it seldom exceeds 200 Hz. With the stiffnesses and dimensions of modules and leads discussed in
发表于 2025-3-27 18:03:20 | 显示全部楼层
Assembly of Cards and Boards,and its structural analysis features. The length, height, and depth (. × . × .) dimensions of the assembly are 38 × 30 × 27 cm (15 × 12 × 11 in.). The major structural elements (Fig. 14.1) are 1) the frame, 2) planar boards, 3) card-to-board connectors, and 4) the cards.
发表于 2025-3-27 22:29:02 | 显示全部楼层
Elements of Structural Analysis,explained through simplified analysis. Structural theory is nurtured by the mechanics of materials, the theories of elasticity and plasticity, of plates and shells, vibrations, thermal stresses, and probably half a dozen other engineering endeavors.
发表于 2025-3-28 06:07:06 | 显示全部楼层
Finite Element Analysis,chip carrier, its gull wing leads surface soldered to an epoxy-glass circuit card, the assembly deformed owing to temperature [1]. A brief introduction to the highly developed subject of FE will be given here.
发表于 2025-3-28 07:13:18 | 显示全部楼层
发表于 2025-3-28 13:22:57 | 显示全部楼层
 关于派博传思  派博传思旗下网站  友情链接
派博传思介绍 公司地理位置 论文服务流程 影响因子官网 SITEMAP 大讲堂 北京大学 Oxford Uni. Harvard Uni.
发展历史沿革 期刊点评 投稿经验总结 SCIENCEGARD IMPACTFACTOR 派博系数 清华大学 Yale Uni. Stanford Uni.
|Archiver|手机版|小黑屋| 派博传思国际 ( 京公网安备110108008328) GMT+8, 2025-6-11 10:31
Copyright © 2001-2015 派博传思   京公网安备110108008328 版权所有 All rights reserved
快速回复 返回顶部 返回列表