Titlebook: Speciality Polymers/Polymer Physics; Yu. K. Godovsky,K. Horie,V. S. Papkov Conference proceedings 1989 Springer-Verlag Berlin Heidelberg 1

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书目名称Speciality Polymers/Polymer Physics影响因子(影响力)




书目名称Speciality Polymers/Polymer Physics影响因子(影响力)学科排名




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书目名称Speciality Polymers/Polymer Physics网络公开度学科排名




书目名称Speciality Polymers/Polymer Physics被引频次




书目名称Speciality Polymers/Polymer Physics被引频次学科排名




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书目名称Speciality Polymers/Polymer Physics年度引用学科排名




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书目名称Speciality Polymers/Polymer Physics读者反馈学科排名

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Speciality Polymers/Polymer Physics978-3-540-46010-7Series ISSN 0065-3195 Series E-ISSN 1436-5030

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Advances in Polymer Sciencehttp://image.papertrans.cn/s/image/873736.jpg

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狂热语言

Reactions and Photodynamics in Polymer Solids,Reactions in amorphous polymer solids are first characterized in terms of influences of molecular motion of matrix polymers and non-homogeneity of reaction sites. Specific features of photophysical processes, photoisomerization, photodimerization, chain scission and crosslinking reactions in polymer solids are then discussed separately.

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Thermotropic Mesophases in Element-Organic Polymers,tituents and flexible spacers. The state of order of polyorganosiloxanes is analysed in comparison to mesophase states of linear and cyclic low molecular siloxanes. The lyotropic mesophase behaviour of the ladder polyorganosiloxanes is also examined briefly.

担忧

Synthesis and Structure of Macromolecular Topological Compounds,view is paid to issues of synthesis and investigation of polyrotaxanes. These studies are concerned with the statistical synthesis (by Agam and Zilkha), directed synthesis (by Maciejewski), and synthesis with elements of directionality.

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Epoxy Molding Compounds as Encapsulation Materials for Microelectronic Devices,ectronic encapsulation. This paper reviews the fundamental properties of epoxy molding compounds and explains the roles and characteristics of the following components which represent encapsulation materials; epoxy resins, hardeners, accelerators, flexibilizers, fillers, flame retardants, coupling agents, and release agents.

难解

Epoxy Molding Compounds as Encapsulation Materials for Microelectronic Devices,nd productivity advantages. On the other hand, as chip sizes become larger due to increased integration of devices, compacter packages are in demand to realize the higher integration. Advances in surface mounting technologies demand encapsulation materials which have extremely low thermal stress and