Titlebook: Solid State Lighting Reliability; Components to System W.D. van Driel,X.J. Fan Book 2013 Springer Science+Business Media, LLC 2013 LED Lumi

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Solid-State Lighting Technology in a Nutshell,SL is based on the semiconductor-based LED and its packaging technology. The LED module can be obtained by cooperation of electronic devices. By integrating the hardware and software, the luminaire and further lighting system can be achieved. This chapter will describe the key elements of SSL techno

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Failure Mechanisms and Reliability Issues in LEDs, make their failure modes and mechanisms different. This chapter presents a definite, comprehensive and up-to-date guide to industry and academic research on LED failure mechanisms and reliability. It will help readers focus resources in an effective manner to assess and improve LED reliability for

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Failure Modes and Failure Analysis,e linked and interact with each other, they are described separately in this chapter. For each level of the system, the dominant failure modes are summarized, and where possible related models describing the degradation are discussed. The chapter is illustrated with pictures of failure modes and an

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Solder Joint Reliability in Solid-State Lighting Applications,. The interest in solder joint reliability has increased by the introduction of the so-called high brightness leadless type of packages. Solder joint reliability is one of the main failure modes in these package types, especially when it comes down to lifetimes beyond 20,000 h. Many end customers re

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A Multiscale Approach for Interfacial Delamination in Solid-State Lighting, LED packages suffer from delamination as well, mainly due to the fact that transparent materials are needed to pass the light from the device to the surroundings. Using these kinds of materials has a significant impact on the mismatch of material properties. Any gap in the optical pathway will crea

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,On the Effect of Microscopic Surface Roughness on Macroscopic Polymer–Metal Adhesion,crease in surface area, is the transition from adhesive to cohesive failure, i.e., crack kinking. This chapter presents several analysis methods to study this phenomenon. First, a semi-analytical approach is discussed in which the competition between adhesive and cohesive cracking is analyzed by mea