书目名称 | Silicon Nitride for Microelectronic Applications | 副标题 | Part 1 Preparation a | 编辑 | John T. Milek | 视频video | http://file.papertrans.cn/868/867322/867322.mp4 | 图书封面 |  | 描述 | The large amount of literature on the technology of thin film silicon nitride indi cates the interest of the Department of Defense, NASA and the semiconductor industry in the development and full utilization of the material. This survey is concerned only with the thin film characteristics and properties of silicon nitride as currently utilized by the semiconductor or microelectronics industry. It also includes the various methods of preparation. Applications in microelectronic devices and circuits are to be provided in Part 2 of the survey. Some bulk silicon nitride property data is included for basic reference and comparison purposes. The survey specifically excludes references and information not within the public domain. ACKNOWLEDGEMENT This survey was generated under U.S. Air Force Contract F33615-70-C-1348, with Mr. B.R. Emrich (MAAM) Air Force Materials Laboratory, Wright-Patterson Air Force Base, Ohio acting as Project Engineer. The author would like to acknowledge the assis tance of Dr. Judd Q. Bartling, Litton Systems, Inc., Guidance and Control Systems Division, Woodland Hills, California and Dr. Thomas C. Hall, Hughes Aircraft Company, Culver City, California in review | 出版日期 | Book 1971 | 关键词 | circuit; control; control system; development; electronics; engine; information; material; materials; microel | 版次 | 1 | doi | https://doi.org/10.1007/978-1-4684-6162-6 | isbn_softcover | 978-1-4684-6164-0 | isbn_ebook | 978-1-4684-6162-6 | copyright | Springer Science+Business Media New York 1971 |
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