| 书目名称 | Silicon Carbide Microsystems for Harsh Environments |
| 编辑 | Muthu B.J. Wijesundara,Robert Azevedo |
| 视频video | |
| 概述 | Addresses the SiC platform for complete microsystems and goes beyond the individual device level. -Covers state-of-the-art SiC electronics.Provides a comprehensive collection of SiC technologies infor |
| 丛书名称 | MEMS Reference Shelf |
| 图书封面 |  |
| 描述 | Silicon Carbide Microsystems for Harsh Environments reviews state-of-the-art Silicon Carbide (SiC) technologies that, when combined, create microsystems capable of surviving in harsh environments, technological readiness of the system components, key issues when integrating these components into systems, and other hurdles in harsh environment operation.The authors use the SiC technology platform suite the model platform for developing harsh environment microsystems and then detail the current status of the specific individual technologies (electronics, MEMS, packaging). Additionally, methods towards system level integration of components and key challenges are evaluated and discussed based on the current state of SiC materials processing and device technology. Issues such as temperature mismatch, process compatibility and temperature stability of individual components and how these issues manifest when building the system receive thorough investigation. The material covered not only reviews the state-of-the-art MEMS devices, provides a framework for the joining of electronics and MEMS along with packaging into usable harsh-environment-ready sensor modules. |
| 出版日期 | Book 2011 |
| 关键词 | Electronic Packaging; Harsh Environments; MEMS; Materials Processing; Mechanical Engineering; Microelectr |
| 版次 | 1 |
| doi | https://doi.org/10.1007/978-1-4419-7121-0 |
| isbn_softcover | 978-1-4614-2882-4 |
| isbn_ebook | 978-1-4419-7121-0Series ISSN 1936-4407 Series E-ISSN 1936-4415 |
| issn_series | 1936-4407 |
| copyright | Springer Science+Business Media, LLC 2011 |
发表于 2025-3-21 18:27:30
