Titlebook: Reliability Physics and Engineering; Time-To-Failure Mode J. W. McPherson Textbook 20132nd edition Springer International Publishing Switze

教条

书目名称Reliability Physics and Engineering影响因子(影响力)




书目名称Reliability Physics and Engineering影响因子(影响力)学科排名




书目名称Reliability Physics and Engineering网络公开度




书目名称Reliability Physics and Engineering网络公开度学科排名




书目名称Reliability Physics and Engineering被引频次




书目名称Reliability Physics and Engineering被引频次学科排名




书目名称Reliability Physics and Engineering年度引用




书目名称Reliability Physics and Engineering年度引用学科排名




书目名称Reliability Physics and Engineering读者反馈




书目名称Reliability Physics and Engineering读者反馈学科排名

朦胧

六个才偏离

Materials and Device Degradation,ated with precision semiconductor devices (threshold voltages, drive currents, interconnect resistances, capacitor leakage, etc.) will degrade with time. In order to understand the useful lifetime of the device, it is important to be able to model how critically important material/device parameters degrade with time.

不整齐

Conversion of Dynamical Stresses into Effective Static Values,anging during operation and generally depend on the frequency of operation. In mechanical devices, the mechanical stress usually varies with time (the mechanical stress in a metal light pole changes with wind direction and with wind speed while the mechanical stress in the shaft of a rotor changes with the number of rpm).

聚集

Increasing the Reliability of Device/Product Designs, the designed device. It states that the designer tried to stay below the expected material’s strength distribution by some safety factor .. For example, the designer may have used a safety factor of . = 2.

木讷

Screening,adation to the good/strong devices? The use of a short-duration stress to eliminate weak devices is generally referred to as .. We will find that screening can sometimes be very effective, but not always. Screening effectiveness depends on the exact details of the .. for the devices plus the magnitude and duration of the screening stress.

arterioles

Heat Generation and Dissipation,tion begins, the rate of increase in temperature of the device/material will depend upon on the .. within the device, the .. of the materials, and the .. from the device to the .. (which is often the ambient).

挡泥板

Sampling Plans and Confidence Intervals,from the population and this sample is tested/stressed to determine the fraction defective. After the fraction defective is determined for the sample, then it is only natural to ask: based on the . used, what is the . for the population fraction defective? To answer this critically important question, we must understand the basics of .

正面

ARC

Materials and Device Degradation, evidence for degradation is apparently everywhere in nature. A fresh coating of paint on a house will eventually crack and peel. The finish on a new automobile will oxidize with time. The tight tolerances associated with finely meshed gears will deteriorate with time. The critical parameters associ