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Titlebook: Microelectronics Manufacturing Diagnostics Handbook; Abraham H. Landzberg Book 1993 Springer Science+Business Media New York 1993 diagnosi

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发表于 2025-3-21 16:33:28 | 显示全部楼层 |阅读模式
书目名称Microelectronics Manufacturing Diagnostics Handbook
编辑Abraham H. Landzberg
视频video
图书封面Titlebook: Microelectronics Manufacturing Diagnostics Handbook;  Abraham H. Landzberg Book 1993 Springer Science+Business Media New York 1993 diagnosi
描述The world of microelectronics is filled with cusses measurement systems, manufacturing many success stories. From the use of semi­ control techniques, test, diagnostics, and fail­ ure analysis. It discusses methods for modeling conductors for powerful desktop computers to their use in maintaining optimum engine per­ and reducing defects, and for preventing de­ formance in modem automobiles, they have fects in the first place. The approach described, clearly improved our daily lives. The broad while geared to the microelectronics world, has useability of the technology is enabled, how­ applicability to any manufacturing process of similar complexity. The authors comprise some ever, only by the progress made in reducing their cost and improving their reliability. De­ of the best scientific minds in the world, and fect reduction receives a significant focus in our are practitioners of the art. The information modem manufacturing world, and high-quality captured here is world class. I know you will diagnostics is the key step in that process. find the material to be an excellent reference in of product failures enables step func­ Analysis your application. tion improvements in yield an
出版日期Book 1993
关键词diagnosis; manufacturing; material; reliability; semiconductor devices
版次1
doihttps://doi.org/10.1007/978-1-4615-2029-0
isbn_softcover978-1-4613-5840-4
isbn_ebook978-1-4615-2029-0
copyrightSpringer Science+Business Media New York 1993
The information of publication is updating

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Manufacturing Yield,ircuit (IC) chips to optimize cost and technology. In turn, cost is dependent on manufacturing yield, which is the thrust of yield management at the initiation of a new technology, and the focus of this chapter.
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Artificial Intelligence Techniques for Analysis: Expert Systems and Neural Networks,ms, and so on” (Barr and Feigenbaum 1981). In this chapter, we focus on two areas of artificial intelligence that have shown great promise in microelectronic manufacturing diagnosis: expert systems and neural networks.
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Bum-in,SI semiconductor engineer. Covered in this chapter is a discussion of the important parameters affecting the burn-in, how to model the effects of burn-in and how to implement an effective burn-in process.
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Manufacturing Defect Classification System,em will enable better communications between professionals in the field. Hundreds of different defect types exist, and many of the defects mentioned here are also discussed in other chapters of the hand-book.
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In-Line Electrical Test,the line. Here, the cumulative effect of processes can be determined prior to final or functional test at the end of the process line. In-line test determines how the product is doing, while building takes place.
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