Titlebook: Magnetic Bubble Technology; Andrew H. Eschenfelder Book 19801st edition Springer-Verlag Berlin Heidelberg 1980 Sensor.development.electron

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Andrew H. Eschenfelder PhDe main contributors to the field.Goes beyond the formalism o.This monograph on the homotopy theory of topologized diagrams of spaces and spectra gives an expert account of a subject at the foundation of motivic homotopy theory and the theory of topological modular forms in stable homotopy theory..Be

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e main contributors to the field.Goes beyond the formalism o.This monograph on the homotopy theory of topologized diagrams of spaces and spectra gives an expert account of a subject at the foundation of motivic homotopy theory and the theory of topological modular forms in stable homotopy theory..Be

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Static Properties of Magnetic Bubbles,er we shall consider the properties of moving bubbles. The state of motion will require the introduction of a few new “dynamic” parameters and will also induce some variations in the “static” parameters that we will use to describe the bubble at rest.

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Basic Permalloy-Bar Bubble Devices,and better the operation of basic bubble devices. In this chapter we consider permalloy-bar devices which provided the basis for the first practical bubble products in the late 1970’s. In the next chapter we shall consider other forms of bubble devices that use different propagation mechanisms, such

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Other Bubble Device Forms,netic poles, under the influence of a rotating field, to propagate bubbles. Other forms have been investigated in an attempt to achieve higher density for a given lithography, which is specified by the minimum feature, ., that can be realiably defined thereby. In PB devices the minimum feature is th

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Bubble Materials,asis is on crystalline films which are grown on nonmagnetic garnet substrates by liquid phase epitaxy. In addition, we consider in some depth both crystalline hexaferrites and amorphous rare-earth transition metal films. Orthoferrites will be mentioned only to give literature references. The rationa

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Device Chip Fabrication,pter we review the steps involved in the fabrication of chips and some of the fundamental concepts that underlie the specification of those process steps. After the chips have been made they must be enclosed in a package that supplies electrical contact, the required bias and rotating drive field, e

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