Titlebook: Handbook of Photovoltaic Silicon; Deren Yang Living reference work 20200th edition Impurity and Defect.Photovoltaic Energy Conversion.Sil

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Wafer Processing,e wires, the slurries, the wafer quality, and the experimental methods, which have been developed to characterize wafers and the consumables. The fundamental micromechanical sawing processes and models are also described. Their knowledge is helpful to improve the sawing process in a controlled way.

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Characterization of Wafers and Supply Materials,ation processes also require a basic understanding of the interaction processes between wires, sawing fluid, and the silicon material. Special experimental methods, which have been developed to investigate the fundamental micromechanical processes and their ramifications on the wafer quality paramet

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Grain Boundaries in Multicrystalline Silicon,ial distribution, and grain size will be presented in this chapter..The main part of the chapter presents a detailed treatment of the occurrence of the various types of grain boundaries and the related dislocations structures for different variants of the DS method. The most important DS variants di

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Hydrogenated Amorphous Silicon Thin Film,ayer, (2) large area uniform deposition for low-cost mass productions, and (3) deposition on various foreign substrates for rigid and flexible solar modules. The main disadvantage of a-Si:H is the lower carriers mobility and lifetime than the crystal copartners, which result in the lower energy conv

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Hydrogenated Microcrystalline Silicon Thin Films,ion, carrier transport, and stability. The material’s property affects the solar cell performance significantly. The material structure changes with the film thickness under a constant deposition condition, which influences the solar cell performance. For solar cell applications, it has been found t

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Xiaoxia Liu,Pramatha Payra,Yuepeng Wanoles. Research findings are implemented in conservation management, urban planning and global change mitigation strategies...This book identifies emerging fields and new challenges that are discussed within the978-90-481-2390-2978-1-4020-4436-6Series ISSN 1572-7742 Series E-ISSN 1875-1210