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Titlebook: Economics of Electronic Design, Manufacture and Test; Magdy Abadir,Tony Ambler Book 1994 Springer Science+Business Media New York 1994 ana

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书目名称Economics of Electronic Design, Manufacture and Test
编辑Magdy Abadir,Tony Ambler
视频video
图书封面Titlebook: Economics of Electronic Design, Manufacture and Test;  Magdy Abadir,Tony Ambler Book 1994 Springer Science+Business Media New York 1994 ana
描述The general understanding of .design. is that it shouldlead to a manufacturable product. Neither the design nor the processof manufacturing is perfect. As a result, the product will be faulty,will require .testing. and fixing. Where does .economics.enter this scenario? .Consider the cost of testing and fixing the product. If a manufacturedproduct is grossly faulty, or too many of the products are faulty, thecost of testing and fixing will be high. Suppose we do not like that.We then ask what is the cause of the faulty product. There must besomething wrong in the manufacturing process. We trace this cause andfix it. Suppose we fix all possible causes and have no defectiveproducts. We would have eliminated the need for testing. .Unfortunately, things are not so perfect. There is a cost involvedwith finding and eliminating the causes of faults. We thus have twocosts: the cost of testing and fixing (we will call it cost-1), andthe cost of finding and eliminating causes of faults (call it cost-2).Both costs, in some way, are included in the overall cost of theproduct. If we try to eliminate cost-1, cost-2 goes up, and viceversa. An economic system of production will minimize the overall
出版日期Book 1994
关键词analog; boundary scan; manufacturing; modeling; production; quality assurance; testing
版次1
doihttps://doi.org/10.1007/978-1-4757-5048-5
isbn_softcover978-1-4419-5142-7
isbn_ebook978-1-4757-5048-5
copyrightSpringer Science+Business Media New York 1994
The information of publication is updating

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High Level Test Economics Advisor (Hi-TEA),ever, deciding on where and when to test and whether to apply Design For Test DFT) and Built-In Self-Test (BIST) at the IC, multichip module (MCM) or board level requires considerable study and evaluation to determine the economics of the various solutions and the payback. In this article we describ
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Multichip Systems Trade-Off Analysis Tool,gn and manufacturing risks by allowing system designers to view the entire performance design space early in the design cycle prior to the initiation of traditional physical design activities..This article describes a software tool that performs interdisciplinary trade-off analysis and partitioning
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Trade-off Analysis on Cost and Manufacturing Technology of an Electronic Product: Case Study,y comparing the system cost and packaging metrics with those of comparable consumer products, we have determined that there is opportunity for significant cost, size, and weight reduction of the overall electronics packaging system. These include the use of fine pitch IC packages, smaller discrete c
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Cost Based Surface Mount PCB Design Evaluation,timating activities need to be speeded up. Consequently, the traditional gap between the designer who designs new products and the estimator who evaluates the financial consequences of the design is fading. Cost optimization is being integrated in the design process, and the designer needs to take m
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Sensitivity Analysis in Economics Based Test Strategy Planning,at a few parameters—e.g., the gate count—need very detailed estimates, whereas the accuracy of many other parameters is insignificant in 99% of all cases. The techniques presented allow an in-depth evaluation of what is perceived as the main drawback in the use of economic modeling methods, namely,
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Boundary Scan in Board Manufacturing,d is a composite of several actual products. Methods for effectively developing a boundary scan test are examined along with some of the advantages of approaching the development in unique ways. Additionally, the criteria for using these methods are developed. Results for test development time and t
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