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Titlebook: Coupled Data Communication Techniques for High-Performance and Low-Power Computing; Ron Ho,Robert Drost Book 2010 Springer-Verlag US 2010

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书目名称Coupled Data Communication Techniques for High-Performance and Low-Power Computing
编辑Ron Ho,Robert Drost
视频video
概述Serves as a collection of the best-known-methods and ideas from leaders in the field..Includes a carefully-selected set of discussions on the important issues, tradeoffs, and techniques in coupled dat
丛书名称Integrated Circuits and Systems
图书封面Titlebook: Coupled Data Communication Techniques for High-Performance and Low-Power Computing;  Ron Ho,Robert Drost Book 2010 Springer-Verlag US 2010
描述Wafer-scale integration has long been the dream of system designers. Instead of chopping a wafer into a few hundred or a few thousand chips, one would just connect the circuits on the entire wafer. What an enormous capability wafer-scale integration would offer: all those millions of circuits connected by high-speed on-chip wires. Unfortunately, the best known optical systems can provide suitably ?ne resolution only over an area much smaller than a whole wafer. There is no known way to pattern a whole wafer with transistors and wires small enough for modern circuits. Statistical defects present a ?rmer barrier to wafer-scale integration. Flaws appear regularly in integrated circuits; the larger the circuit area, the more probable there is a ?aw. If such ?aws were the result only of dust one might reduce their numbers, but ?aws are also the inevitable result of small scale. Each feature on a modern integrated circuit is carved out by only a small number of photons in the lithographic process. Each transistor gets its electrical properties from only a small number of impurity atoms in its tiny area. Inevitably, the quantized nature of light and the atomic nature of matter produce sta
出版日期Book 2010
关键词Drost; Signal; chip packaging; communication; complexity; coupled data communication; high-performance; int
版次1
doihttps://doi.org/10.1007/978-1-4419-6588-2
isbn_softcover978-1-4614-2617-2
isbn_ebook978-1-4419-6588-2Series ISSN 1558-9412 Series E-ISSN 1558-9420
issn_series 1558-9412
copyrightSpringer-Verlag US 2010
The information of publication is updating

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1558-9412 e important issues, tradeoffs, and techniques in coupled datWafer-scale integration has long been the dream of system designers. Instead of chopping a wafer into a few hundred or a few thousand chips, one would just connect the circuits on the entire wafer. What an enormous capability wafer-scale in
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Book 2010 just connect the circuits on the entire wafer. What an enormous capability wafer-scale integration would offer: all those millions of circuits connected by high-speed on-chip wires. Unfortunately, the best known optical systems can provide suitably ?ne resolution only over an area much smaller than
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Power delivery, signaling and cooling for 2D and 3D integrated systems
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Use of AC Coupled Interconnect in Contactless Packaging
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