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Titlebook: Applications of Ion Beams to Metals; S. T. Picraux,E. P. EerNisse,F. L. Vook Book 1974 Plenum Press, New York 1974 corrosion.electron micr

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Ion Beam Studies of Metal-Metal and Metal-Semiconductor Reactionscess temperatures are below the eutectic. Although backscattering techniques provide depth-microscopy, supplemental measurements are often required to establish lateral uniformity and the relative importance of grain boundary and bulk diffusion.
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Encyclopedic Dictionary of Polymersoms was located in the metal, in the latter they were entirely contained by the oxide layer; see Fig. 1. The depths of the implants after both the air-formed and pre-formed oxide films had been thickened anodically, were determined using a 2 MeV He beam in the manner described in detail in Ref. (1).
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Movement of Ions During the Anodic Oxidation of Aluminumoms was located in the metal, in the latter they were entirely contained by the oxide layer; see Fig. 1. The depths of the implants after both the air-formed and pre-formed oxide films had been thickened anodically, were determined using a 2 MeV He beam in the manner described in detail in Ref. (1).
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Reactions of Thin Metal Films with Si or SiO2 Substratessilicide in the form of an intermediate layer largely free of oxygen. The oxygen originally bound to the Si in the SiO. is transferred to the remaining metal layer. Residual oxygen “in the metal film and metal oxides on the metal film influence the silicide formation.
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