找回密码
 To register

QQ登录

只需一步,快速开始

扫一扫,访问微社区

SCIE期刊IEEE TRANSACTIONS ON DEVICE AND MATERIALS RELIABILITY 2024/2025影响因子:2.516 (IEEE T DEVICE MAT RE) (1530-4388). (EN

[复制链接]
查看: 44918|回复: 35
发表于 2025-3-21 16:16:24 | 显示全部楼层 |阅读模式
期刊全称IEEE TRANSACTIONS ON DEVICE AND MATERIALS RELIABILITY
期刊简称IEEE T DEVICE MAT RE
影响因子20242.516
视频video
ISSN1530-4388
eISSN1558-2574
出版商IEEE-INST ELECTRICAL ELECTRONICS ENGINEERS INC
发行地址445 HOES LANE, PISCATAWAY, USA, NJ, 08855-4141
学科分类1.Science Citation Index Expanded (SCIE)--Engineering, Electrical & Electronic | Physics, Applied; 2.Current Contents Electronics & Telecommunications Collection--Electronics & Electrical Engineering; 3.Current Contents Engineering, Computing & Technology--Electrical & Electronics Engineering; 4.Essential Science Indicators--Engineering;
出版语言English
The information of publication is updating

SCIE(SCI)期刊IEEE TRANSACTIONS ON DEVICE AND MATERIALS RELIABILITY(20 21 REV HIST)影响因子


SCIE(SCI)期刊IEEE TRANSACTIONS ON DEVICE AND MATERIALS RELIABILITY(IEEE T DEVICE MAT RE)影响因子@(工程,电气和电子)学科排名


SCIE(SCI)期刊IEEE TRANSACTIONS ON DEVICE AND MATERIALS RELIABILITY(20 21 REV HIST)总引论文


SCIE(SCI)期刊IEEE TRANSACTIONS ON DEVICE AND MATERIALS RELIABILITY(IEEE T DEVICE MAT RE)总引论文@(工程,电气和电子)学科排名


SCIE(SCI)期刊IEEE TRANSACTIONS ON DEVICE AND MATERIALS RELIABILITY(20 21 REV HIST)影响因子


SCIE(SCI)期刊IEEE TRANSACTIONS ON DEVICE AND MATERIALS RELIABILITY(IEEE T DEVICE MAT RE)总引频次@(工程,电气和电子)学科排名


SCIE(SCI)期刊IEEE TRANSACTIONS ON DEVICE AND MATERIALS RELIABILITY(20 21 REV HIST)即时影响因子


SCIE(SCI)期刊IEEE TRANSACTIONS ON DEVICE AND MATERIALS RELIABILITY(IEEE T DEVICE MAT RE)即时影响因子@(工程,电气和电子)学科排名


SCIE(SCI)期刊IEEE TRANSACTIONS ON DEVICE AND MATERIALS RELIABILITY(20 21 REV HIST)五年累积影响因子


SCIE(SCI)期刊IEEE TRANSACTIONS ON DEVICE AND MATERIALS RELIABILITY(IEEE T DEVICE MAT RE)五年累积影响因子@(工程,电气和电子)学科排名


单选投票, 共有 0 人参与投票
 

0票 0%

Perfect with Aesthetics

 

0票 0%

Better Implies Difficulty

 

0票 0%

Good and Satisfactory

 

0票 0%

Adverse Performance

 

0票 0%

Disdainful Garbage

您所在的用户组没有投票权限
发表于 2025-3-21 21:15:56 | 显示全部楼层
发表于 2025-3-22 03:10:43 | 显示全部楼层
Submitted on: 02 October 2012. Revised on: 24 December 2012. Accepted on: 31 January 2013. ___________________IEEE TRANSACTIONS ON DEVICE AND MATERIALS RELIABILITY
发表于 2025-3-22 05:15:01 | 显示全部楼层
发表于 2025-3-22 12:10:39 | 显示全部楼层
Submitted on: 12 November 2018. Revised on: 27 February 2019. Accepted on: 01 April 2019. ___________________IEEE TRANSACTIONS ON DEVICE AND MATERIALS RELIABILITY
发表于 2025-3-22 16:16:19 | 显示全部楼层
发表于 2025-3-22 21:01:02 | 显示全部楼层
发表于 2025-3-22 22:24:29 | 显示全部楼层
Submitted on: 12 February 2003. Revised on: 23 March 2003. Accepted on: 11 May 2003. ___________________IEEE TRANSACTIONS ON DEVICE AND MATERIALS RELIABILITY
发表于 2025-3-23 04:02:57 | 显示全部楼层
发表于 2025-3-23 09:11:15 | 显示全部楼层
 关于派博传思  派博传思旗下网站  友情链接
派博传思介绍 公司地理位置 论文服务流程 影响因子官网 SITEMAP 大讲堂 北京大学 Oxford Uni. Harvard Uni.
发展历史沿革 期刊点评 投稿经验总结 SCIENCEGARD IMPACTFACTOR 派博系数 清华大学 Yale Uni. Stanford Uni.
|Archiver|手机版|小黑屋| 派博传思国际 ( 京公网安备110108008328) GMT+8, 2025-4-27 00:35
Copyright © 2001-2015 派博传思   京公网安备110108008328 版权所有 All rights reserved
快速回复 返回顶部 返回列表