| 期刊全称 | 3D Microelectronic Packaging | | 期刊简称 | From Fundamentals to | | 影响因子2023 | Yan Li,Deepak Goyal | | 视频video | | | 发行地址 | Provides comprehensive coverage of the state-of-the-art in 3D microelectronic packages.Covers advanced materials and processes, quality and reliability concerns, and fault isolation and failure analys | | 学科分类 | Springer Series in Advanced Microelectronics | | 图书封面 |  | | 影响因子 | This volume provides a comprehensive reference for graduate students and professionals in both academia and industry on the fundamentals, processing details, and applications of 3D microelectronic packaging, an industry trend for future microelectronic packages. Chapters written by experts cover the most recent research results and industry progress in the following areas: TSV, die processing, micro bumps, direct bonding, thermal compression bonding, advanced materials, heat dissipation, thermal management, thermal mechanical modeling, quality, reliability, fault isolation, and failure analysis of 3D microelectronic packages. Numerous images, tables, and didactic schematics are included throughout. This essential volume equips readers with an in-depth understanding of all aspects of 3D packaging, including packaging architecture, processing, thermal mechanical and moisture related reliability concerns, common failures, developing areas, and future challenges, providing insights into key areas for future research and development. | | Pindex | Book 20171st edition |
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发表于 2025-3-21 17:17:40
