Overview: Presents both in theory and practice.Comprehensive studies in design, materials, process, fabrication, and reliability of various technology.Provides in-depth treatment of a number of major topics in .This book focuses on the design, materials, process, fabrication, and reliability of flip chip, hybrid bonding, fan-in, and fan-out technology. Both principles and engineering practice have been addressed, with more weight placed on engineering practice. This is achieved by providing in-depth study on a number of major topics such as wafer bumping, flip chip assembly, underfill and reli
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