无聊点好 发表于 2025-3-26 22:22:41
http://reply.papertrans.cn/88/8799/879837/879837_31.pngdithiolethione 发表于 2025-3-27 03:16:45
http://reply.papertrans.cn/88/8799/879837/879837_32.pngSoliloquy 发表于 2025-3-27 05:40:48
Approximate Engineering Theory for the Twisting of Compliant Leaded Circuit Card/Module Systems, analysis benefits from the symmetries. This chapter will introduce the basic problems involved in the twisting of circuit cards, and an approximate solution will be shown for a single module attached to a card. This approximate treatment, while useful in defining some concepts, also produces accept万灵丹 发表于 2025-3-27 09:31:19
Thermal Stresses in Compliant Leaded Systems,s, however, is induced in the operational mode, owing to the differential expansion of interconnected components. Even before functional stress cycles can test the fatigue strength of the leads, severe thermal loads may arise during the cooling accompanying manufacturing, i.e., the soldering (reflowirradicable 发表于 2025-3-27 15:13:04
Dynamic Response of Circuit Card Systems,ead/card system, the card is the most flexible element; the fundamental natural frequency .. for circuit cards is generally between 20 and 50 Hz, and even for multimodule stiff cards or stiffened boards, it seldom exceeds 200 Hz. With the stiffnesses and dimensions of modules and leads discussed in发起 发表于 2025-3-27 18:03:20
Assembly of Cards and Boards,and its structural analysis features. The length, height, and depth (. × . × .) dimensions of the assembly are 38 × 30 × 27 cm (15 × 12 × 11 in.). The major structural elements (Fig. 14.1) are 1) the frame, 2) planar boards, 3) card-to-board connectors, and 4) the cards.下垂 发表于 2025-3-27 22:29:02
Elements of Structural Analysis,explained through simplified analysis. Structural theory is nurtured by the mechanics of materials, the theories of elasticity and plasticity, of plates and shells, vibrations, thermal stresses, and probably half a dozen other engineering endeavors.表被动 发表于 2025-3-28 06:07:06
Finite Element Analysis,chip carrier, its gull wing leads surface soldered to an epoxy-glass circuit card, the assembly deformed owing to temperature . A brief introduction to the highly developed subject of FE will be given here.Mammal 发表于 2025-3-28 07:13:18
http://reply.papertrans.cn/88/8799/879837/879837_39.pngliaison 发表于 2025-3-28 13:22:57
http://reply.papertrans.cn/88/8799/879837/879837_40.png