挑剔为人
发表于 2025-3-26 23:54:24
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婴儿
发表于 2025-3-27 03:49:51
J. W. McPhersonth literary figures on a footing of equality, and the imperious self-assurance in the solitary heights of genius and absolute power; yielding to momentary impulses to the point of abandon, and heroic courage in the face of adversity which has parallels and examples only in the classic days of Rome.
Ambulatory
发表于 2025-3-27 06:58:45
the emphasis of this book is clearly on the physics of failure and developing the reliability engineering tools required for product improvements during device-design and device-fabrication phases..978-3-319-93683-3
Hearten
发表于 2025-3-27 11:47:28
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CLAIM
发表于 2025-3-27 16:35:15
Time-to-Failure Models for Selected Failure Mechanisms in Integrated Circuits, addition, the use of dissimilar materials in a chip and in the assembly process produces a number of thermal expansion mismatches which can drive large thermomechanical stresses. These thermomechanical stresses can result in failure mechanisms such as stress migration (SM), creep, fatigue, cracking
MAPLE
发表于 2025-3-27 18:40:04
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VEST
发表于 2025-3-28 00:48:08
https://doi.org/10.1007/978-3-319-93683-3Device Reliability; Failure Modeling and statistics; Failure Rate Reduction; Maintenance and Reliabilit
cinder
发表于 2025-3-28 03:10:53
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Conjuction
发表于 2025-3-28 08:18:25
J. W. McPhersonProvides a comprehensive textbook on reliability physics of semiconductors, from fundamentals to applications;.Explains the fundamentals of reliability physics and engineering tools for building bette
伦理学
发表于 2025-3-28 12:51:37
Springer Nature Switzerland AG 2019