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André Herchuelz,Nathalie Pacherag appeared previously (numbers two, three, four and eleven). Detailed acknowledgement of prior publication is made in the notes to the relevant chapters. I am indebted to the editors of the several publications involved for their kind permission to use this material. And I am particularly grateful tBATE 发表于 2025-3-22 05:58:26
Daniel Khananshvili Ph.D.them having appeared previously (numbers two, three, four and eleven). Detailed acknowledgement of prior publication is made in the notes to the relevant chapters. I am indebted to the editors of the several publications involved for their kind permission to use this material. And I am particularlychisel 发表于 2025-3-22 10:45:13
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Jialin Chen,Susanne Smaardijk,Ilse Vandecaetsbeek,Peter Vangheluweing professionals and for scientists and engineers working in the field of mechanical microsensors, this practical monograph introduces novel measurement technologies that allow for in situ and real-time examination of physical processes during the packaging process or during subsequent reliability