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Thomas Barbot,Cédric Montigny,Paulette Decottignies,Marc le Maire,Christine Jaxel,Nadège Jamin,Veronding and flip-chip characterization are also illustrated. The reader will gain much insight into the important field of interconnection technology in semiconductor packaging..978-3-642-06063-2978-3-540-26945-8Series ISSN 1615-8326 Series E-ISSN 2365-0680inventory 发表于 2025-3-29 19:09:13
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Jialin Chen,Susanne Smaardijk,Ilse Vandecaetsbeek,Peter Vangheluweding and flip-chip characterization are also illustrated. The reader will gain much insight into the important field of interconnection technology in semiconductor packaging..978-3-642-06063-2978-3-540-26945-8Series ISSN 1615-8326 Series E-ISSN 2365-0680