恶名声 发表于 2025-3-23 12:32:23
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Evaluation of Leakage Current in 1-D Silicon Dangling-Bond Wire Due to Dopants,e, we choose an ideal 1-D surface interconnect made out of Si dangling bonds in an otherwise passivated Si(100)-H surface. The current lost into a doped silicon substrate from a surface-supported nanowire is evaluated using transport calculations based on the density functional theory. We consideredCommentary 发表于 2025-3-23 23:40:31
Direct Integration of Carbon Nanotubes in Si Microsystems,ned CNT synthesis conditions and show that simplified designs can perform comparable to more complex ones. The Si/CNT/Si circuits obtained can show rectifying (Schottky-like) or near-ohmic behaviour. Gas sensing possibilities are demonstrated, indicating the possibility of monitoring ageing/fermenti构成 发表于 2025-3-24 02:57:22
Single-Crystal Au Triangles as Reconfigurable Contacts for Atomically Smooth Surfaces: Ultra-High Vted transfer-printing tool was designed and constructed to perform this transfer printing task in a UHV environment. Preliminary results from scanning electron microscopy and low-temperature scanning tunneling microscopy are presented.Gleason-score 发表于 2025-3-24 08:20:30
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Novel Nanostructured Passives for RF and Power Applications: Nanopackaging with Passive Components, nanostructured materials for high-density capacitors and inductors in power modules. The second part of the chapter describes application of nanoscale materials as nanocomposite dielectrics and magneto-dielectrics with stable and high permeability and permittivity for miniaturized RF modules.MULTI 发表于 2025-3-24 18:19:50
Xavier Baillin,Christian Joachim,Gilles PouponOffers a multi-disciplinary approach to the packaging field.Discusses the latest developments in packaging specifications and technological developments in the study of atomic scale circuits and devicCoronation 发表于 2025-3-24 21:22:01
978-3-319-35650-1Springer International Publishing Switzerland 2015Redundant 发表于 2025-3-25 02:20:57
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