overrule
发表于 2025-3-26 23:32:37
Utilization of Peridynamic Theory for Modeling at the Nano-Scale,echanics (CCM) and Molecular Dynamics (MD). Due to its length-scale parameter, horizon, it is capable of capturing phenomena occurring at different length scales, including the nano-scale. Furthermore, van der Waals forces can be represented in a straightforward manner using a buffer-layer approach.
铁砧
发表于 2025-3-27 02:07:34
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某人
发表于 2025-3-27 08:22:38
Direct Integration of Carbon Nanotubes in Si Microsystems,l properties in real devices. However, the CNT-to-microsystem integration is challenging to implement in a manufacturable, cost-effective industrial process. This text presents our work towards a process for making complete CMOS/MEMS systems with integrated CNTs. We demonstrate the feasibility of th
Noctambulant
发表于 2025-3-27 11:04:54
Nanopackaging Requests for Atomic Scale Circuits and Molecule-Machines,ossible architectures of an atomic scale Boolean logic circuit are discussed in the prospect to be supported by such a surface and encapsulated at the end of the fabrication process. This leads to look after the best possible interconnection strategy to beneficiate from the possibly large calculatin
雀斑
发表于 2025-3-27 17:10:23
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Antimicrobial
发表于 2025-3-27 18:24:49
Site-Selective Self-Assembly of Nano-Objects on a Planar Substrate Based on Surface Chemical Functie chemistry, we can enable whole sets of different nano-objects to be selectively deposited onto well-defined submicronic anchoring sites on macroscopic substrates. This potentially enables the development of unprecedented systems in different fields such as electronics, photonics or biosensors.
Psychogenic
发表于 2025-3-27 23:52:45
Silicon Technologies for Nanoscale Device Packaging,tecting and electrically connecting a nanoscale device positioned on a perfect Si(001)-(2 × 1):H surface smoothed thanks to a 950 °C thermal treatment. The nano-device is connected to nanopads implanted on the silicon surface. Each nanopad is linked to a nanovia which is locally achieved by etching
Preamble
发表于 2025-3-28 05:48:03
Designing Carbon Nanotube Interconnects for Radio Frequency Applications,eed for RF technologies that can operate at much higher frequencies, which can be potentially used for satellite or tetra-hertz imaging applications. Thus, there is a strong interest for novel materials, which can have more reliable and stable high-frequency performance. Flip chip is one of the tech
懒惰人民
发表于 2025-3-28 09:29:33
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Fortify
发表于 2025-3-28 11:53:45
Novel Nanostructured Passives for RF and Power Applications: Nanopackaging with Passive Components,ey enabler for next-generation multifunctional miniaturized systems. Traditional microscale materials do not lead to adequate enhancement in volumetric densities to miniaturize passive components as thin films or thin integrated passive devices. With these materials, component miniaturization also d