使无罪
发表于 2025-3-21 17:41:16
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CRANK
发表于 2025-3-21 20:27:01
Soft Mold Nanoimprint: Modeling and Simulation,een the nano-patterned mold and the polymer film substrate. It is suggested that a hydrophobic silane coating is necessary for reducing the adhesion force between the mold and the substrate leading to a successful printing result.
变态
发表于 2025-3-22 00:36:00
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Aids209
发表于 2025-3-22 04:50:39
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Limited
发表于 2025-3-22 12:31:05
Nano-conductive Adhesives, ECAs in the 1950s . Recently, ECA materials have been identified as one of the major alternatives for lead-containing solders for microelectronic packaging applications. There are two types of conductive adhesives: isotropically conductive adhesives (ICAs) and anisotropically conductive adhesives/films (ACAs/ACFs).
backdrop
发表于 2025-3-22 15:57:28
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Nuance
发表于 2025-3-22 20:04:39
nationally recognized contributors, as well as updates in al.This book presents a comprehensive overview of nanoscale electronics and systems packaging, and covers nanoscale structures, nanoelectronics packaging, applications of nanoparticles, graphene, carbon nanotubes and nanowires in packaging, a
粗俗人
发表于 2025-3-22 21:41:01
Nanoparticle Fabrication,ions of physical and chemical processes are reviewed to understand recent progress in the industrial production for metal nanoparticles and related materials. This chapter also describes utilization of the nanomaterials for preparing electric wires, electrodes, and interconnects.
合并
发表于 2025-3-23 01:36:46
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突袭
发表于 2025-3-23 07:14:55
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