Abjure
发表于 2025-3-25 05:43:13
Advances in Delamination Modeling of Metal/Polymer Systems: Continuum Aspects,tance in order to establish physically correct, unambiguous values of the adhesion properties, which can only be achieved by proper multi-scale techniques..The topic “Advances in Delamination Modeling” has been split into two separate chapters: this chapter discusses the continuum aspects of delamin
最高点
发表于 2025-3-25 09:35:21
Advances in Delamination Modeling of Metal/Polymer Systems: Atomistic Aspects,tance in order to establish physically correct, unambiguous, values of the adhesion properties, which can only be achieved by proper multi-scale techniques..The topic “Advances in Delamination Modeling” has been split into two separate chapters: this chapter discusses the atomistic aspects of delami
阶层
发表于 2025-3-25 13:40:40
Nanoparticle-Based High-, Dielectric Composites: Opportunities and Challenges,roperties and the long-term stability of capacitors built into PCBs are described. High-k nanocrystalline thin-film layers prepared in various methods are also presented. Brief descriptions of thick-film and ceramic high-k materials with very good reliability and extended operation temperature are i
ETCH
发表于 2025-3-25 18:34:12
Nanostructured Resistor Materials,ts, and improvement of wireability and frequency due to elimination of parasitic inductance. The material, technological, and constructional solutions and their relation with the electrical and stability properties chosen are analyzed in detail for modern microresistors, both described in the litera
rods366
发表于 2025-3-25 21:21:04
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薄荷醇
发表于 2025-3-26 00:54:14
A Study of Nanoparticles in SnAg-Based Lead-Free Solders,-based solder alloys, did not increase IMC thickness and grain size significantly after the solder reflow process and thermal aging. hence, these nano particles resulted in good drop test performance compared to Cu, Ag, Au, Zn, Al, In, P, Ge, Sb.
不规则的跳动
发表于 2025-3-26 04:47:55
Nano-underfills and Potting Compounds for Fine-Pitch Electronics,ve been presented. The use of explicit finite element models for capturing the transient dynamic response under high-g mechanical shock of unpotted and potted electronics assemblies have been discussed.
constellation
发表于 2025-3-26 08:31:34
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SPER
发表于 2025-3-26 13:32:08
High Electromagnetic Shielding of Plastic Transceiver Packaging Using Dispersed Multiwall Carbon Naof using the dispersive MWCNT composites for the high SE and suitability for packaging low-cost and high-performance optical transceiver modules used in the fiber-to-the-home (FTTH) lightwave transmission systems.
Psa617
发表于 2025-3-26 17:37:02
Book 2018Latest editiond health effects of nanopackaging technologies, and more. This book is an ideal reference for researchers, practicing engineers, and graduate students who are either entering the field for the first time, or are already conducting research and want to expand their knowledge in the field of nanopacka